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    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

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    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

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Remcom Announces Circuit Co-Simulation In XFdtd Electromagnetic Simulation Software

14.12.2017
Reading Time: 1 min read
A A

source: Globe News Wire article

State College, PA, Dec. 13, 2017 (GLOBE NEWSWIRE) — Remcom announces circuit co-simulation and expanded signal integrity capabilities in the latest update to XFdtd® 3D Electromagnetic Simulation Software. 

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Circuit co-simulation facilitates a more realistic analysis of device performance by including imported circuit components within the electromagnetic simulation.  The schematic for a desired component may be imported into XF via a netlist file, with support for SPICE elements such as resistors, capacitors, inductors, coupled inductors, and subcircuits.  Netlist components can also be assigned as a matching circuit embedded within a feed, simplifying matching network design.

This release also introduces a nodal waveguide interface with enhanced options for computing S-parameters.  A user-defined reference impedance enables renormalized S-parameters to be computed for transmission lines that would typically display an impedance mismatch.  A nodal excitation is also available for simulations that do not require S-parameters to be collected.

featured image: Surface mounted capacitor is updated during the FDTD simulation based on its SPICE model.

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