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    TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

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Remcom Announces Circuit Co-Simulation In XFdtd Electromagnetic Simulation Software

14.12.2017
Reading Time: 1 min read
A A

source: Globe News Wire article

State College, PA, Dec. 13, 2017 (GLOBE NEWSWIRE) — Remcom announces circuit co-simulation and expanded signal integrity capabilities in the latest update to XFdtd® 3D Electromagnetic Simulation Software. 

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Circuit co-simulation facilitates a more realistic analysis of device performance by including imported circuit components within the electromagnetic simulation.  The schematic for a desired component may be imported into XF via a netlist file, with support for SPICE elements such as resistors, capacitors, inductors, coupled inductors, and subcircuits.  Netlist components can also be assigned as a matching circuit embedded within a feed, simplifying matching network design.

This release also introduces a nodal waveguide interface with enhanced options for computing S-parameters.  A user-defined reference impedance enables renormalized S-parameters to be computed for transmission lines that would typically display an impedance mismatch.  A nodal excitation is also available for simulations that do not require S-parameters to be collected.

featured image: Surface mounted capacitor is updated during the FDTD simulation based on its SPICE model.

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