Samsung Electro-Mechanics has introduced a 10 µF, 100 V X7T molded frame capacitor for the output stage of 48 V AI server power supply units.
The CL32Z106KCFMNW# combines a ceramic capacitor with a metal frame and epoxy molding, addressing board-bending stress and environmental exposure in output-filter capacitor banks.
Key features and benefits
- 10 µF nominal capacitance and 100 V DC rated voltage for output-stage filtering in 48 V AI server PSUs.
- 1210 inch / 3225 metric size designation.
- X7T dielectric, with a temperature-characteristic range of −55 °C to +125 °C.
- Metal frame that absorbs PCB deformation stress and reduces its transmission to the ceramic chip.
- Epoxy molding around the chip to provide a barrier against humidity, dust and physical contact.
The MFC construction addresses the mechanical connection between the PCB and the ceramic capacitor. Rather than relying on the ceramic body to accommodate board deformation, the external frame provides a stress-absorbing structure.
Technical highlights
| Parameter | Value |
|---|---|
| Product designation | CL32Z106KCFMNW# |
| Component technology | Molded frame MLCC |
| Nominal capacitance | 10 µF |
| Capacitance tolerance | ±10% |
| Rated voltage | 100 V DC |
| Size designation | 1210 / 3225 |
| Dielectric | X7T |
| Temperature-characteristic range | −55 °C to +125 °C |
| Temperature-related capacitance change | −33% to +22% |
The X7T temperature characteristic allows capacitance to change by −33% to +22% relative to its reference value over the temperature range, without DC bias. This temperature characteristic and the ±10% initial capacitance tolerance are separate selection parameters.
For output-filter design, nominal capacitance is therefore a starting point rather than a complete description of circuit behaviour. The capacitor bank should be assessed at its operating voltage and temperature, with the required output-ripple performance as the design criterion.
Metal frame and epoxy molding
PCB bending during manufacture and assembly can initiate microcracks in ceramic dielectric layers. These cracks can develop into short-circuit paths under electrical stress. The metal frame absorbs deformation stress before it reaches the ceramic chip, addressing the mechanism behind MLCC flex cracking and capacitor failure.
The epoxy molding surrounds the chip and separates it from external humidity, dust and physical impact. The frame and molding serve different functions: the frame manages mechanical stress transfer, while the encapsulation provides an environmental and physical barrier.
Typical applications
The primary application is ripple suppression at the output of 48 V AI server PSUs. In this circuit position, ceramic MLCCs operate alongside aluminium capacitors as part of the output-filter network.
The 100 V DC rating supports selection for this 48 V output application, while the 10 µF nominal capacitance contributes to the ceramic portion of the filter bank. The molded frame construction is relevant where large PSU boards experience bending during manufacturing and assembly.
The wider MFC family also targets power circuits and DC-DC converters where PCB bending stress is an important design consideration.
Application fit
Selection involves both electrical filtering requirements and the mechanical conditions of the assembled power supply. The capacitance and voltage rating govern the electrical starting point; the frame and epoxy molding address stress and exposure around the ceramic chip.
The X7T capacitance-temperature characteristic deserves particular attention when establishing the minimum capacitance required by the output filter. Initial tolerance and temperature-related variation should be treated separately rather than using the nominal 10 µF value throughout the design.
The 1210 / 3225 designation is a size code. PCB layout should use the molded-frame package outline and land pattern, rather than a footprint selected from the size code alone.
Design-in notes for engineers
- Assess operating voltage, ripple and transient excursions against the 100 V DC rating.
- Establish the capacitance required at the operating voltage and temperature before fixing the capacitor-bank population.
- Include the ±10% initial tolerance and the X7T temperature characteristic in the capacitance budget.
- Use the package-specific outline, land pattern and assembly requirements when preparing the PCB footprint.
- Address PCB bending during manufacturing and assembly as part of the mechanical design.
- Validate the final selection under actual operating conditions before production release.
Further reading
- MLCC Class II DC BIAS Explained, Samsung Video
- MLCC DC BIAS and AGEING Capacitance Loss Explained
- Temperature, Bias and Ageing Impact to MLCC Ceramic Capacitors
Source
This article is based on the Samsung Electro-Mechanics product announcement and official product documentation. Engineers should refer to the current manufacturer datasheet for final design and qualification.
References
- Introducing the 1210 X7T 10uF 100V MFC (Molded Frame Capacitor): A Key Solution for the 48V Output Voltage of AI Server PSUs, Samsung Electro-Mechanics, 21 October 2026.
- Multilayer Ceramic Capacitors — Part I: Commercial/Industrial, Samsung Electro-Mechanics.
- MLCC Product Search and Part Numbering Guide, Samsung Electro-Mechanics.
- MFC — MLCC with a High Tolerance to Cracking, Samsung Electro-Mechanics.
