Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends

    TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors

    Modelithics Extends Models for Microchip PIN and Varactor Diodes

    Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

    Wk 28 Electronics Supply Chain Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends

    TT Electronics: How Qualification Underpins Reliable Selection of Thick‑Film Resistors

    Modelithics Extends Models for Microchip PIN and Varactor Diodes

    Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

    Wk 28 Electronics Supply Chain Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samtec Agreed with Molex Second-Source License on High-Speed Interconnects for Data Centers

18.9.2025
Reading Time: 2 mins read
A A

Samtec, Inc., the service leader in the connector industry and a premier provider of high-speed connectivity solutions, and Molex, a global electronics leader and connectivity innovator, announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family. 

This collaboration provides customers with extended product availability and supply flexibility to a portfolio of robust, scalable connectivity solutions for a wide range of high-performance applications demanding high signal integrity and density.

RelatedPosts

Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options

Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard

Key Interconnect Technologies for 2025

The Si-Fly HD product family delivers industry-leading signal integrity for high-speed applications and supports data rates critical for modern networking, communications, and computing systems. As part of the agreement, Molex will manufacture and distribute these interconnects to customers worldwide, ensuring uninterrupted access to advanced connectivity solutions, while benefiting from the combined engineering and support expertise of both teams.

“Collaborating with Molex as a second source for Si-Fly HD demonstrates our commitment to providing customers with reliable worldwide supply and exceptional technical support,” said Brian Vicich, CTO of Samtec. “Molex’s manufacturing capabilities, deep engineering expertise, and global reach make them an ideal resource to extend the availability of this high-performance interconnect family.”

The agreement reflects a strategic alignment between industry leaders focused on delivering high-speed, high-density interconnect solutions for a wide range of data center, high-performance computing, artificial intelligence and machine learning applications. Customers can expect the same quality, form, fit, and function from Molex’s Si-Fly HD products, ensuring seamless integration into existing Samtec-based systems.

“Working together strengthens our commitment to providing customers with greater optionality and supply flexibility, while expanding our product portfolio,” said Jairo Guerrero, vice president & general manager, Copper Solutions, Molex. “By combining our technical expertise with Samtec’s innovative technology, we’re ensuring customers have seamless access to high-performance interconnect solutions that support their evolving design and supply chain needs.” 

Related

Source: Samtec

Recent Posts

LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

14.7.2026
91

In the Age of AI, Every Watt Counts: Implications for Components

13.7.2026
115

Molex Unveils Automotive Ethernet Connectors for Next‑Gen SDV Architectures

2.7.2026
54

ECIA Industry Pulse June 2026 Reaches Five‑Year High

1.7.2026
118

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
1k

binder Prints Electronics on 3D Components Connector Surface

1.7.2026
26

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
676

AI Hardware Demand for Passive Components Dossier

30.6.2026
188

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

29.6.2026
172

Upcoming Events

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

Jul 29
17:30 - 18:30 CEST

To Ferrite or to Nanocrystalline in Transformer Design

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.