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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

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    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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Samtec Agreed with Molex Second-Source License on High-Speed Interconnects for Data Centers

18.9.2025
Reading Time: 2 mins read
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Samtec, Inc., the service leader in the connector industry and a premier provider of high-speed connectivity solutions, and Molex, a global electronics leader and connectivity innovator, announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family. 

This collaboration provides customers with extended product availability and supply flexibility to a portfolio of robust, scalable connectivity solutions for a wide range of high-performance applications demanding high signal integrity and density.

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The Si-Fly HD product family delivers industry-leading signal integrity for high-speed applications and supports data rates critical for modern networking, communications, and computing systems. As part of the agreement, Molex will manufacture and distribute these interconnects to customers worldwide, ensuring uninterrupted access to advanced connectivity solutions, while benefiting from the combined engineering and support expertise of both teams.

“Collaborating with Molex as a second source for Si-Fly HD demonstrates our commitment to providing customers with reliable worldwide supply and exceptional technical support,” said Brian Vicich, CTO of Samtec. “Molex’s manufacturing capabilities, deep engineering expertise, and global reach make them an ideal resource to extend the availability of this high-performance interconnect family.”

The agreement reflects a strategic alignment between industry leaders focused on delivering high-speed, high-density interconnect solutions for a wide range of data center, high-performance computing, artificial intelligence and machine learning applications. Customers can expect the same quality, form, fit, and function from Molex’s Si-Fly HD products, ensuring seamless integration into existing Samtec-based systems.

“Working together strengthens our commitment to providing customers with greater optionality and supply flexibility, while expanding our product portfolio,” said Jairo Guerrero, vice president & general manager, Copper Solutions, Molex. “By combining our technical expertise with Samtec’s innovative technology, we’re ensuring customers have seamless access to high-performance interconnect solutions that support their evolving design and supply chain needs.” 

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Source: Samtec

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