Smoltek Semi joins an elite club of companies achieving 1 µF/mm² capacitance density, but stands alone in reaching this milestone with an ultra-thin profile.
This breakthrough unlocks the under-chip real estate that represents the holy grail of capacitor placement in modern electronics.
Smoltek Semi has made a remarkable achievement by achieving 1 microfarad (µF) of capacitance on an area measuring just one square micrometer. This significant milestone represents a dramatic leap from nanofarads to microfarads, a territory that seemed almost mythical just a few years ago for ultra-thin wafer based integrated capacitors.
While we are not the first to cross this coveted line, as a few other companies have achieved this prestigious milestone in the specialized field of ultra-thin capacitor technologies, our accomplishment sets us apart in this exclusive club. We managed to reach 1 µF/mm² while keeping our capacitor incredibly thin, unlocking possibilities that others simply cannot match.
The proximity imperative
Today’s smartphones boast more computing power than room-sized supercomputers from decades ago. High-performance computing (HPC) centers and AI accelerators push processing speeds to extraordinary limits. However, this performance comes with a fundamental challenge: as chips become faster, they become more demanding about their power supply.
Imagine transistors as incredibly fast switches, flipping billions of times per second between ones and zeros. Each flip demands instant energy, creating power fluctuations that would cripple performance without intervention. Capacitors serve as lightning-fast energy reservoirs, absorbing excess power and releasing stored energy precisely when needed. The closer these capacitors sit to the chip, the better their performance. Distance means delay, and delay means degraded performance. The ultimate proximity lies directly under the chip, nestled between the solder balls that connect the processor to the circuit board. However, this prime real estate comes with a merciless constraint: height.
The ultra-thin breakthrough
Here’s where most solutions hit their limitation wall. Achieving 1 µF/mm² while fitting under solder balls demands an ultra-thin profile. The solder balls themselves define the height limit—typically allowing only minimal clearance for integrated components. Smoltek has cracked this code with a capacitor featuring an active layer of just 6 micrometers. To put this into perspective, a human hair measures about 70 micrometers in diameter. Smoltek’s active capacitor layer could fit more than ten times under the width of a single hair. This isn’t just thin; it’s what engineers call “truly ultra-thin” for the critical performance area.
This achievement transforms Smoltek from another member of the 1 microfarad per square millimeter club into the only company capable of delivering that performance where it matters most: in the space-constrained under-chip environment where every micrometer counts.
Building forests, not digging trenches
Understanding Smoltek’s breakthrough requires grasping how CNF-MIM capacitors function. Deep Trench Capacitors (DTC) carve deep trenches, akin to miniature wells, into a silicon substrate. In contrast, CNF-MIM manufacturing employs a fundamentally different approach by growing forests of carbon nanofibers on a substrate. Imagine microscopic trees, each about 10,000 times thinner than human hair, standing vertically in dense formation.
The magic happens during the layering process. Each carbon nanofiber is coated with metal, applied atom by atom using Atomic Layer Deposition (ALD). Over this metal layer, Smoltek applies its proprietary ZrO₂–Al₂O₃ dielectric stack, again, atom by atom with atomic precision. Finally, another metal layer completes the structure, creating a metal-insulator-metal capacitor at the nanoscale. Smoltek’s atom-by-atom construction enables it to utilize 100% of the surface area provided by carbon nanofibers. This is achieved through a precision ALD process, which is the only method that can achieve complete coverage. This makes ALD essential for maximizing capacitance density.
The SkyTech partnership enables Smoltek to scale up production. The precision ALD process that makes carbon nanofiber metalization (CNF-MIM) possible requires specialized equipment at industrial scale. Smoltek has partnered with SkyTech, a Taiwanese leader in ALD equipment for the semiconductor industry.
Through this partnership, Smoltek gains access to the same industrial-scale deposition technology used throughout semiconductor manufacturing. SkyTech’s expertise ensures that Smoltek’s processes maintain their performance characteristics as they transition from laboratory to mass production. Most importantly, the collaboration demonstrates real-world scalability. Once the processes are fully developed, scaling up for mass production becomes straightforward. This is not laboratory innovation that might work someday—it’s production-ready technology with a clear path to the market.
The cost equation advantage
Beyond superior performance, CNF-MIM technology delivers compelling economics. While competing technologies, such as DTC, require multiple expensive ALD processes to achieve similar results, Smoltek’s approach requires significantly fewer layers—directly translating to lower production costs. ALD represents one of the most expensive processes in semiconductor manufacturing. However, CNF technology can achieve the same capacity with fewer ALD layers compared to deep trench alternatives, resulting in cost advantages that compound with each performance increment. This isn’t just about better technology; it’s about better technology that costs less to produce.
The economic implications are profound: as performance requirements increase, traditional approaches see exponential cost growth, while CNF-MIM maintains cost efficiency through its superior three-dimensional architecture.
From laboratory to production reality
These results aren’t laboratory curiosities achieved under perfect conditions. The majority of tested devices showed consistent capacitance density with reliable reproducibility—the hallmark of mature technology ready for commercialization.
While current data originates from simplified CNF-MIM devices in laboratory settings, the same dielectric stack produces prototypes and products achieving identical performance. The 18-month development process has resulted in production-ready processes that directly translate to commercial manufacturing.
The development focus has now shifted to improving insulation resistance, which is essential for minimizing leakage current and ensuring long-term reliability in commercial applications.
Industry validation
The significance of Smoltek’s achievement extends beyond technical metrics. In a recent interview, leading capacitor manufacturer Yageo acknowledged the groundbreaking capabilities of CNF-MIM technology.
This industry validation confirms what technical data suggests: Smoltek has developed something genuinely unique in the capacitor industry. Expert recognition from a major industry player underscores the commercial potential of a technology that solves problems others can’t even address.
Every smartphone, AI accelerator, and HPC processor requires capacitors for power stabilization. Physics dictates that closer placement means better performance, and under-chip real estate offers the ultimate proximity. Yet, until now, no technology could deliver meaningful capacitance in this space while meeting height constraints.
Smoltek has solved this equation. We’ve joined the exclusive 1 µF/mm² club while standing alone in our ability to achieve this performance with ultra-thin profiles. As electronics continue their relentless march toward higher performance in smaller packages, this unique capability transforms from technical curiosity to commercial necessity.
The path from laboratory breakthrough to market dominance runs through problems that only one company can solve. For investors seeking exposure to technologies that address seemingly impossible constraints, Smoltek offers capabilities that literally don’t exist anywhere else.
Smoltek and ITRI Goes for Small Scale Production of CNF-MIM Capacitors
Smoltek Semi has initiated the signing of a technical service agreement with the Taiwanese Industrial Technology Research Institute (ITRI) that enables low-volume production of Smoltek’s propriety CNF-MIM capacitors.
The formal signing process of the agreement, enabling low-volume production of Smoltek’s ultra-thin CNF-MIM capacitors, is expected to be completed within days. As part of the collaboration, Smoltek will install and bring up its advanced CVD tool (carbon nanofiber growth tool) at ITRI. This marks the beginning of the industrialization of Smoltek’s technology for ultra-thin capacitors aimed at advanced processor chips.
“The Technical Service Agreement allows us to accelerate our roadmap and engage more closely with potential customers who require early samples of our high-performance, ultra-thin capacitors.”
Farzan Ghavanini, CTO of Smoltek
The technical service agreement ensures that Smoltek gains seamless access to ITRI’s specialized technical competence and engineering resources—an essential step in preparing for commercial deployment. This arrangement allows the company to refine its processes under industrial conditions while leveraging ITRI’s semiconductor R&D environment.
“Smoltek’s innovative CNF-MIM capacitor technology is highly relevant to the semiconductor industry’s drive for greater miniaturization and performance. By combining our advanced R&D infrastructure and engineering expertise with Smoltek’s unique nanotechnology, we aim to accelerate the path toward industrial adoption.”
Dr. Arthur Lin, Division Director at ITRI’s Smart Sensing & Systems Technology Center
Furthermore, the installation and integration of Smoltek’s custom-designed CVD tool at ITRI’s facilities enables a complete and seamless fabrication process to be carried out in one location. This integrated setup is a critical enabler for small-scale production, as it reduces logistics complexity, shortens development cycles, and ensures tighter process control.
“Having our advanced CVD tool on-site at ITRI gives us access to a complete value chain—from material growth to capacitor integration—in a single location. This is a key milestone toward bringing our technology from lab to fab.”
Magnus Andersson, CEO of Smoltek
Smoltek’s patent protected CNF-MIM™ technology enables the fabrication of extremely thin capacitors with high capacitance density. These are ideally suited for integration in the minimal space beneath advanced processor chips—an area where electrical performance and form factor are both critical. This gives Smoltek’s technology a unique competitive advantage for next-generation devices in mobile, AI, and high-performance computing markets.
