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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

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    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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Wk 08 Electronics Supply Chain Digest

26.2.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 2-23-24

DATAPOINT OF THE WEEK: S&P reported February US Flash mfg PMI of 51.5 vs 50.7 in January, reflecting the sharpest upturn since Sep 2022 with renewed growth in output and orders.

RelatedPosts

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Despite stronger demand conditions, S&P notes Industrial companies continued to reduce their input buying, albeit at a slower pace. S&P also reported Eurozone flash mfg PMI of 46.1 vs 46.6 in January, reflecting an accelerating decline in output after the moderation seen in January and a sharper decline in new orders.

Output and new orders fell the most in Germany, where Feb flash PMI dropped to 42.3 from 45.5 in January.

Headlines:

Auto

  • Audi union in Mexico agrees to salary hike, ending strike
  • Price war in China’s passenger car market to remain fierce in 2024, says CPCA secretary-general
  • Feb retail auto sales in China expected to decline seasonally by more than 40% M/M
  • Signs of first casualties in China EV with HiPhi suspending operations for at least 6 months
  • Global xEV sales increased 30% in 2023, projected to grow at the same rate in 2024 by TrendForce
  • US to soften tailpipe rules, slow EV transition through 2030
  • New car sales in Europe better than seasonal; BEV penetration down to a year low, ICE penetration up to 50% from 44% in Dec
  • Mercedes delays Electrification goals, sees ICE in the line-up beyond 2030
  • Rivian projects flat 2024 EV production; announces 10% workforce cut
  • New car sales in Germany weaker than seasonal in January. xEV and BEV penetration down to Jan-23 low
  • Toyota extends shutdown of two production lines after emission test irregularities

Industrial

  • MLCC ceramic capacitor shipments to decline 7% Q/Q in 1Q says TrendForce

Semiconductors

  • Fears of ASML equipment used for China military behind the Dutch government’s decision to restrict ASML sales
  • ADI sees revenue bottoming 36% lower in Apr-Q before rebounding in July
  • ADI and TSMC have entered into LTA for supply of key auto technologies from TSMC’s capacity in Japan
  • ASE has bought two back-end facilities from Infineon
  • US reportedly suspends permission for materials shipping to SMIC but states no plan to restrict sales of mature chips to China
  • China firms cutting OLED DDI prices says DigiTimes
  • GlobalFoundries to receive $1.5B subsidy from the CHIPS Act
  • Intel rumored to receive $10B of subsidy from the US CHIPS Act
  • Microsoft to use Intel’s foundry services for custom chip manufacturing
  • Intel says Arrow Lake and Lunar Lake PC CPUs to be manufactured on TSMC’s 3nm process.
  • US Department of Energy gives SK Siltron $544M loan to expand SiC wafer manufacturing in Michigan
  • Nividia continues to set record results driven by robust AI demand
  • Kioxia and Western Digital merger talks expected to resume in April

Other

  • Foldable smartphone shipments to grow 11% in 2024 to 17.7m units says TrendForce

Related

Source: Edgewater Research

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