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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Trending Tags

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Aerosol Jet Printing Technology Opportunities

5.12.2019
Reading Time: 2 mins read
A A
source: RICE, FEE University of West Bohemia, EPCI e-Symposium

Abstract:

Aerosol Jet is a selective direct writing deposition technology. It generates aerosol from an inserted ink and aerodynamically focuses this aerosol in a print head. This allows the aerosol beam to be focused to the distance (between the tip of the deposition nozzle and a substrate) up to 15 mm. Thanks to that, the printing on 3D substrate can be realized even with 2D motion system.

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The deposition of the wide range of materials is possible (nanoparticle conductive inks, dielectrics, organic based materials, carbon nanotubes even bioactive materials or enzymes). These featured can lead in a development, for example, of new generation of printed capacitors using sandwich construction with silver nanoparticle aerosol Jet printed electrodes and printed dielectrics layer.

This technology could be used also for RFID tags printing on 3D substrates. The manufacturing of the smart packages for IoT (Internet of Things) networks could be one of its future applications. The presented slides are providing an overview of Aerosol Jet Printing capabilities.


Title: Aerosol Jet Printing Technology Opportunities
Author(s): Jiri Navratil, Radek Soukup
Organisation(s): Department of Technologies and Measurements / RICE, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 4.1.  New Development Session., PCNS2017 Proceedings Pg.69-74
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Commercial
e-Sessions Scope Components: Capacitors, RF passives
e-Sessions Topics: Technology


read the full paper in pdf here.

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