3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid...
Read moreScientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing...
Read moreNot graphene: researchers in Germany and Finland discover new type of atomically thin carbon material with metallic properties that is...
Read moreVery thin layers of organic stabiliser residue in metal nanoparticle (MNP) inks are behind a loss of conductivity in 3D...
Read moreMACOM Technology Solutions Inc., a leading supplier of semiconductor products, today announced that it has completed the development of a...
Read moreSmoltek announces that the license agreement, signed with a global manufacturer of electronic components for its technical and commercial evaluation...
Read moreWürth Elektronik will again be holding its virtual trade conference WE meet @ digital days - this time over four...
Read moreSmoltek has developed the world's thinnest capacitor. The company is now demonstrating practically what it has previously claimed by producing...
Read morePCNS Passive Components Networking Symposium organizing committee is pleased to announce Call for Papers for the 3rd international symposium dedicated...
Read moreMiniaturisation? Integration of functions? Increased reliability? IP protection? All this is possible by embedding components into the printed circuit board....
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© EPCI - Premium Passive Components Educational and Information Site