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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

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    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

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    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

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Bourns Introduces 1206 Multilayer Common Mode Filters

16.6.2025
Reading Time: 2 mins read
A A

Bourns Magnetics Product Line proudly announces the launch of the CCF1206 Series Multilayer Common Mode Filters, engineered to deliver reliable performance and support for advanced electronic applications.

The CCF1206 Series features composite co-fired materials, ensuring consistent performance and durability.

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

Its monolithic construction enables a compact size of just 1.25 x 1 x 0.6 mm, optimizing space efficiency while supporting intricate circuit designs in modern small devices.

Key Features:

  • Monolithic Construction: High reliability for demanding applications
  • Compact Size: 1.2 x 1.0 x 0.6 mm, ideal for space-constrained designs
  • Impedance Range: 67 to 120 Ω
  • Current Range: Up to 300 mA
  • DCR Range: 0.5 – 0.6 Ω
  • Operating Temperature: -40 to +85 °C
  • Environmental Compliance: RoHS compliant and halogen-free*

Ideal Applications:

  • High-speed differential signal transmission lines (USB, LVDS)
  • MIPI serial interfaces in mobile devices

Related

Source: Bourns

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