News

Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...

SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...

TDK Corporation and Nippon Chemical Industrial have formally established a joint venture focused on advanced materials and manufacturing processes for...

Electronics Supply Chain Weekly Digest 4-3-26. DATAPOINT OF THE WEEK: S&P reported Mar Eurozone mfg PMI increased to 51.6 from 50.8...

Bourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6...

Edgewater Research’s IP&E report indicates that the recovery trend continued to strengthen through the end of 1Q, with book-to-bill ratios...

Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...

The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial...

Hydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that...

Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...