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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

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    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
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CMSE Advanced Program Announced

2.2.2021
Reading Time: 5 mins read
A A

24th annual CMSE Components for Military & Space Electronics virtual conference that will be held April 19-23, 2021 announced agenda and advanced program.

CMSE is the premier event focused on the design, reliability, and application of electronic components for use in avionics, aerospace, military, and commercial space systems.

RelatedPosts

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

CMSE mission:

Deliver a low cost, virtual conference experience focused on high quality technical talks, keynotes and panel discussions that foster maximum attendee participation/interaction and furthers our collective understanding of the technical challenges faced in our industry. Showcase the supplier base to the greatest extend possible. Educate the industry, especially young component engineers, in order to secure the future defense of our country.

The Program:

  • Keynote talks by industry leaders
  • Over 35 technical presentations by industry experts with Q&A
  • Focused panel discussion on topics such as; use of alternate grade parts for mil and space
  • Vender presentations and virtual exhibits
  • Cutting edge tutorials

Virtual Conference (20th-22nd April 2021)

Included in your registration:

  • 3 days of technical presentations with interactive Q&A
  • Live Keynote presentations each day from industry leaders
  • Access to a FREE 3-hour Tutorial on Monday afternoon on component specs, Overview of Microelectronic Component Specs for Military and Space Electronics (more tutorials available on Monday and Friday for an additional fee)
  • Recordings of all presentations available for review online for up to 30 days
  • PDF copy of slides for each presentation available for download to each attendee
  • Full registration details for all exhibitors and attendee

Tutorial Registration Options

VIRTUAL: Thermal Materials and Testing: Key Solutions for Mil/Aerospace Electronics Systems (4/19)

VIRTUAL: Volatiles Control in Hermetic Electronic Components (4/23)

VIRTUAL: Capacitor Reliability Seminar (4/23)

Passive Components Sessions – 20th April 2021

Session #1A (1120-1300)
Passive Components for Military and Hi Rel Space Systems

Selection of Polymer Tantalum Capacitors for Class A Space Missions
Michael Cozzolino, Raytheon Space

Surface Mount Wet Tantalum Capacitor Technology
Jon Rhan & Mike Mosier, Vishay

Hybrid Capacitor Technology for Hi-Rel Applications
Misha Pierre-Mike, Evans Capacitor Company

Effect of Preconditioning on Post-soldering Failures In Tantalum Capacitors
Alexander Teverovsky, Jacobs Engineering Group

A Comparison of Commercial, Automotive and Aerospace Capacitors
Daniel West, AVX Corporation

Session #1B (1630-1750)
Passive Components for Military and Hi Rel Space Systems

Low Inductance MLCC Capacitors for High Speed Processor Circuits
John Marshall, AVX Corporation

Stacked Polymer Tantalum Capacitors – Advanced Packaging Technology
Joe Vattimo, Vishay Tantalum Division

Tantalum Capacitors: High Reliability Product Hierarchy and New Advance Products
Ed Jones, KEMET

Commercialization of Space: Industry Trends, Component Selection
Wilson Hayworth, KEMET

European Union Session COTS Focus – 22nd April 2021

Session #3A (1000-1120)
European Union Session COTS Focus
Session Chair: Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Evolution of EEE standard with regards to COTS and New Space
Dr. Lacombe Denis, ESA/ESTEC

Title TBD
Manuel Morales, Alter Technology TÜV NORD S.A.U.

Automotive Capacitors Procurement for SME Space Hardware Manufacturer Case Study
Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Method for Qualitative Evaluation of COTS Board Reliability
Vincent Martinez, Serma Technologies

See more presentation topics in complete agenda and advanced program on the link below

Related

Source: CMSE

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Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

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