Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

HLD Europe Enters into Exclusive Negotiations with IK Investment Partners to Acquire EXXELIA

28.1.2020
Reading Time: 3 mins read
A A

HLD Europe has entered into exclusive negotiations with the investment company IK Investment Partners, to become the majority shareholder of Exxelia, the European leader in the manufacturing of high reliability passive components and electromechanical systems.

Exxelia develops and manufactures complex passive components and electromechanical solutions for niche industrial markets such as aeronautics, space, defense, medical and rail, where product reliability and performance are essential. The group addresses main institutional players, systems and equipment manufacturers.

RelatedPosts

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

Exxelia offers a complete and custom product range (capacitors, inductors, resistors, filters, position sensors and rotary joints) embedded into a large number of programs: from the Airbus A350 to the Boeing Dreamliner, from the Ariane 6 launcher to satellite constellations (such as Galileo, Oneweb, etc.), from the Rafale to the F-35, from subway coaches to high-speed trains, from MRI medical equipment to defibrillators.

With an expected proforma revenue of around 170 million euros for 2019 and around 2,000 employees, Exxelia is present today in more than 30 countries and operates in Europe and the United States, in Morocco and in Vietnam through its production sites, its design centers as well as its network of sales partners.

With the support of its new shareholder, Exxelia will be able to intensify its operational excellence and innovation efforts, pursue its internationalization strategy with the penetration of high-growth markets such as India or China, and accelerate its development in the United States.

Paul Maisonnier, CEO of Exxelia:

« I am delighted to embark on a new stage of development with our new shareholders, with whom we share the same vision. Together, we aim to strengthen Exxelia’s unique “one-stop-shop” by offering high-reliability custom products combined with a strong capacity for innovation. We will pursue our continuous improvement approach and our internationalization strategy to make Exxelia a world leader in our niche markets. In that regard, HLD’s experience in international business development is precious to us. We thank IK Investment Partners for its total support over the past 5 years which has enabled us to set up a solid platform capable of supporting our ambitions for global growth, which we are delighted to continue with HLD ».

Dan Soudry, Partner at IK Investment Partners:

« As shareholders of Exxelia since 2015, we are very pleased to have supported the various stages of transformation and growth of the group, through a deep structuring phase led by the management team and an external growth strategy. This has strengthened the group’s presence in the United States, especially with the acquisition of Raf Tabtronics, Deyoung, and Micropen, and diversified its expertise on new product lines ».

Jean-Bernard Lafonta, Founding Partner of HLD Europe and Jean-Hubert Vial, Partner:

« HLD supports successful companies with no restrictions on duration. We believe this specificity was important in the choice of Exxelia’s new shareholder: it is essential to achieve the ambition of growth while considering the long-term nature of Exxelia clients’ programs. We are delighted to be associated with the group’s project, whose entrepreneurial culture echoes the entrepreneurial spirit that drives HLD. We are convinced that we can help Exxelia’s teams by giving them the means to meet their ambitions ».

Related

Source: Exxelia

Recent Posts

ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
0

Emerging Capacitor Markets in Fusion Energy

10.9.2026
2
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
38
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
10

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
36

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

4.9.2026
36

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
15

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
69

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

1.9.2026
51

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved