TDK Releases High Temp 175C Automotive NTC thermistors

17.2.2026

TDK has extended its NTCSP chip thermistor family with new automotive‑grade parts qualified up to 175 °C for conductive‑glue mounting ...

TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors

16.2.2026

11

Researchers at TU Wien have developed a high‑aspect‑ratio superconducting vacuum gap capacitor NEMS structure with plate distances down to just ...

2026 Power Magnetics Design Trends: Flyback, DAB and Planar

13.2.2026

46

Power electronics teams entering 2026 face tighter space, efficiency and time‑to‑market constraints, while magnetics must still behave predictably across thermal ...

Vishay Releases Sulfur‑Resistant Chip Resistors

12.2.2026

11

Vishay’s new RCA‑SR e3 series are AEC‑Q200 qualified thick film chip resistors designed for sulfur‑rich and thermally demanding environments in ...

Würth Elektronik Introduces Lead-Free SMT Spacers

11.2.2026

24

Würth Elektronik has reworked its SMT spacer portfolio to use lead‑free alloys and added new assembly options targeted at high‑volume ...

Schurter Releases EKO HV Fuses up to 1000 VDC, 1100 A

11.2.2026

7

Schurter’s EKO series is a new family of square‑body high‑voltage fuses designed for DC and AC power systems up to ...

Empower Releases High-Density Embedded Silicon Capacitors

11.2.2026

55

Empower Semiconductor has introduced a new generation of embedded silicon capacitors (ECAPs) aimed at improving power delivery networks in high‑current ...