Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ...
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ...
Fringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components. ...
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range specifically targeted at power‑loss protection ...
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression (TVS) diodes designed for automotive ...
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new stocking parts and nearly one ...
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the intricate process of miniaturizing tantalum ...
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids ...
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material ...
Electronics Supply Chain Weekly Digest 4-24-26. DATAPOINTS OF THE WEEK: March new car registrations in Europe totaled 1.58, surpassing the 1M mark ...
Exxelia’s CM‑HVLP series introduces a new generation of SMD high‑voltage reconstituted mica capacitors for designers who need both pulse handling ...
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