This paper is focused on the thick film power resistors with copper terminals. These terminals are manufactured by the new Thick Printed Copper (TPC) technology. This technology is based on sequential screen printing and firing of copper paste in nitrogen atmosphere on alumina substrate.
Title: Thick Film Power Resistor with Thick Printed Copper Terminals
Author(s): Jiri Hlina (1), Jan Reboun (1), Jan Johan (2), Lukas Stepan (2), Ales Hamacek (1)
Organisation(s): (1) Faculty of Electrical Engineering, Department of Technologies and Measurements/RICE, University of West Bohemia, Pilsen, Czech Republic
(2) Elceram a.s., Okružní 1144, Hradec Králové, Czech Republic
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: paper 6.2. Quality & Reliability Session., PCNS2017 Proceedings Pg.128-136
ISBN: 978-80-905 768-8-9
e-Sessions Applications: Industrial
e-Sessions Scope Components: Resistors
e-Sessions Topics: Technology
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