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    Transformer Losses and Thermal Design: Modelling and Validation

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    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

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    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

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    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Trending Tags

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100µm thick silicon capacitors designed for smart cards

24.4.2020
Reading Time: 1 min read
A A

source: IPDiA news

IPDiA, world leader in 3D silicon passive components, has developed a new range of Low Profile capacitors with Enhanced ESD performance (up to 8 kV) dedicated to industries such as Smart Card, RFID tags and others where integration as well as excellent antenna matching play key roles. This new LPSC range targets antenna matching, RF filtering and decoupling of active dies, in applications with height and volume constraints.

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Based on IPDiA technology, this RFID 0402 capacitor range offers low profile (100 µm thin), with very high stability upon applied voltage up to 150 °C, with very low leakage current and high level performance. In order to allow optimization and miniaturization of the overall antenna size, IPDiA is launching a complete range of values from 10 pF up to 330 pF, fully compatible with existing Smart Card and RFID tag manufacturing processes (delivery in T&R or wafers), with same TC as standard RFID ICs and with proven assembly methods such as flip-chip and wirebonding. Furthermore, IPDiA RFID Silicon capacitor range has been fine tuned in order to reach SRF higher than 1.2 GHz, hence allowing unique fine tuning of the antenna, for 13.56 MHz up to UHF (800/900 MHz) applications.

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