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    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

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    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

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Capacitor Trends and Challenges Keynote by EPCI and TTI will be Presented During Passive Bauelemente 2019 Forum

26.6.2019
Reading Time: 1 min read
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Source: EPCI news

Capacitor Trends and Challenges will be discussed as a keynote joined presentation by EPCI and TTI during the Passive Baulemente forum July 2-3, 2019 in Munich, Germany.

RelatedPosts

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

Würth Elektronik Launches ABC of Thermal Management Guide

Don’t miss out the passive component experts Dr. Tomas Zednicek, President EPCI European Passive Components Institute & Martin Barta, Product Development Manager Passives & Discretes – Central Europe, TTI discussing the latest capacitor trends and challenges.

Tomas Zednicek, EPCI is continuously collecting passive components news. The passive component industry is currently going through many challenges facing the new requirements from modern electronics in various applications and directions. On one side, the consumer electronics is moving towards applications such as wearable applications with IoT communication capabilities, supported by the upcoming 5G telecommunication infrastructure, on the other side there are number of demanding new requirements related to energy storage, renewable energies or automotive generation upgrade to EV/ HEV platforms. The presentation will highlight some of the most important passive component milestones on 2018/19 market.

Martin barta, TTI will discuss current passive component market situation with focus on SMD capacitors. Constrained (MLCC) items and items with significant sourcing risk factor call for strategic design decisions and capacitor supply chain optimization. Early identification of potential issues is crucial but not always possible. Presentation will include some tips how to mitigate future supply difficulties and mid-term market outlook.

The Passive Bauelemente Forum Programme Overview:

The programme can be downloaded in pdf here.

The Passive Bauelemente Forum home page and registration – please visit link here.

 

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