3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid...
Read moreDetailsScientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing...
Read moreDetailsLead times are increasing for multiple types of passive electronic components in 2021. Dennis M. Zogbi comment the latest trend...
Read moreDetailsAccording to supply chain, Yageo has recently notified customers that its chip resistors and tantalum capacitors will increase in price...
Read moreDetailsRated for operation at up to 105°C ambient, UL 810 listed, compact size dc-link capacitor series CBB 138 DS from...
Read moreDetailsDespite the current market situation and high demand for electronic components, tantalum supply chain is getting stronger according to industry...
Read moreDetailsThe presentation explains our design considerations for Single Pair Ethernet on the PCB and shows latest measurements for different filter...
Read moreDetails1. A Primer on Aluminum Electrolytic Capacitors The development of the electrolytic capacitor (e-cap) has been one of the main...
Read moreDetailsPassive components makers are closely monitoring the impact of IC shortages on their actual shipments for notebook, server and automotive...
Read moreDetailsMurata Manufacturing Co., Ltd. has developed the GCM21BC71E106ME36 multilayer ceramic capacitor which has a maximum capacitance of 10uF with a...
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© EPCI - Leading Passive Components Educational and Information Site