IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025

119

In this post, inspired by the Samtec blog, we’ll briefly examine IPC-A-610 Class 2 and Class 3 J-lead and Gull...

10 Tips for Ensuring Reliability of Discrete Wire Assemblies

20.2.2025

45

Samtec in its blog compiled ten essential tips for discrete wire assemblies. These guidelines will improve the durability and performance...

How to Determine Chip Temperature

3.1.2025

125

This article written by Dr.-Ing. Martin Schulz, Global Principal, Application Engineering, Littelfuse, provides insight into how to determine packaging chip...

Die and Wire PCB Bonding Explained

17.12.2024

115

This webinar from Würth Elektronik explains principles of die and wire bonding on printed circuit boards including the complete manufacturing...

Polymer Materials and Processing

31.1.2025

29

The majority of connector housings are manufactured from thermoplastic polymers due to their combination of electrical and mechanical properties and...

EMI Shielding Challenges

17.12.2024

8

Explore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics in this Würth...

EMC with Electromechanical Inter-Connections

17.12.2024

8

This Würth Elektronik webinar focuses on the basics of electromagnetic compatibility (EMC) related to the use and applications of electromechanical...

Designing and Testing HDI PCBs for Harsh Environments

17.12.2024

9

In this Würth Elektronik webinar we will offer you insights into HDI PCBs for Harsh Environments: the failure mechanisms of...

RF PCB Connector Impedance Matching and Dynamics

17.12.2024

20

This Würth Elektronik presentation is about sharing impedance variations and comparative analyses of transmission line structures and connector configurations. In...