Robots and humanoid robotic systems are rapidly transforming into sophisticated electromechanical systems. These systems often integrate high-performance AI computing, powerful...
Read moreDetailsThe new SCF76X series from YAGEO Group is a family of three‑phase common mode chokes for high‑current EMI suppression in...
Read moreDetailsSales confidence in the electronic components industry surged in March 2026, with the latest ECIA Industry Pulse survey reporting the...
Read moreDetailsCoilcraft releases KTA5050 series family of molded, shielded power inductors with ultra‑low inductance values optimized for modern low‑voltage, high‑current DC‑DC...
Read moreDetailsLittelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
Read moreDetailsSCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Read moreDetailsBourns has introduced the SRP2008DP Series, a family of low‑profile, high current shielded power inductors in a 2.0 × 1.6...
Read moreDetailsThe Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial...
Read moreDetailsHydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that...
Read moreDetailsWürth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
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