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    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

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    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers

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High Density Interconnect PCBs

11.8.2025
Reading Time: 1 min read
A A

This webinar from Würth Elektronik continue series “PCB Production” with High Density Interconnect (HDI) PCBs.

In this video you will learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

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Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • WE advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

Related

Source: Würth Elektronik

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