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    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

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    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

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KYOCERA Introducing Temperature Change-Resistant TC-SAW Filters

22.1.2024
Reading Time: 2 mins read
A A

KYOCERA Introducing TC-SAW filter technology for the telecommunications market. Kyocera’s unique technology provides high power resistance and excellent temperature characteristics.

One of the performance requirements for SAW filters is a small Temperature Coefficient of Frequency (TCF).

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Kyocera has adopted its own TC-SAW technology (temperature-compensated SAW technology) in order to reduce the frequency fluctuation due to temperature change, i.e., the TCF is small. Kyocera’s TC-SAW achieves high power resistance and excellent temperature characteristics using a piezoelectric material structure and support substrate.

TCF is an abbreviation for Temperature Coefficient of Frequency, TCF indicates the amount of frequency transfer due to temperature.

Features

  • Superior temperature characteristics: The structure of the piezoelectric material and the support substrate are bonded together, making it possible to deal with bands that could not be handled by the piezoelectric material alone.
  • High power resistance: Actualized high-power resistance achieved by increasing heat dissipation.

Applications

  • Telecommunications market

Related

Source: KYOCERA

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