Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

    Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

    Bourns Introduces Automotive Shielded Power Inductors for Compact DC‑DC Converters

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

    SCHURTER Releases Intelligent Three‑Terminal Fuses for Safer Li‑ion Battery Systems

    Can Copper Conductive Inks Displace Silver in Hybrid Electronics?

    Square-Wave Harmonics and RMS Currents in Power Converters

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

15.6.2026
Reading Time: 6 mins read
A A

AI server demand is rapidly absorbing high‑end MLCC capacity and manufacturers are considering price increase of the high end MLCC capacitors needed for these applications.

AI server demand: from forecast to capacity stress

The MLCC industry has been discussing the impact of AI servers on capacitor demand for several years, but 2025–2026 is when this demand is visibly stressing available high‑end capacity. Murata has highlighted that AI‑server‑related MLCC demand is on track for a strong double‑digit CAGR toward 2030, driven by the much higher MLCC counts per accelerator board and per rack compared with conventional servers.

RelatedPosts

Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors

Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

An AI accelerator board can easily integrate tens of thousands of MLCCs across point‑of‑load converters, decoupling networks and auxiliary circuits, and a fully populated AI rack multiplies this into the hundreds of thousands of units. This is not just a volume story: data‑center power‑delivery networks favor high‑CV, low‑ESR MLCCs with tight tolerances, which are precisely the segments where effective capacity is hardest to expand quickly.

In recent comments, Murata president Norio Nakajima confirmed that the company has started internal discussions about raising prices for its more advanced MLCCs used in AI servers. Demand from AI data centers is so strong that it is increasingly difficult to match it with existing capacity while also supporting other strategic markets.

At the same time, Murata emphasizes that it is still in the process of gauging the “true demand” profile for AI infrastructure. The company wants better visibility into whether current order momentum is sustainable, or whether there is a risk of a short‑term spike followed by digestion. As of mid‑February 2026, this means that a decision on specific price actions is pending, and there is no formal corporate notice detailing MLCC price revisions.

Spot MLCC prices already moving

Even without an official Murata list‑price change, the broader MLCC market is already showing the typical symptoms of a tightening cycle. Industry reports from Korea and other regions indicate that spot prices for certain MLCC categories have risen by up to roughly 20% in early 2026, led by high‑grade parts for AI, industrial and automotive applications.

Production line utilization for high‑end MLCCs at leading suppliers is reported to be running at very high levels, effectively close to full for some high‑CV and high‑reliability product segments. At the same time, major manufacturers have remained cautious about adding large new bricks‑and‑mortar capacity after the last boom–bust cycle. The result is a more measured capacity response, where incremental debottlenecking is favored over aggressive greenfield expansions, and where pricing has more room to firm when demand concentrates in specific, higher‑value niches.

The latest AI‑server platforms provide a concrete explanation of why these price discussions are happening now. Moving from general‑purpose servers with around 2 000 MLCCs to training and inference racks with hundreds of thousands of capacitors – and into the million‑parts range for next‑generation Vera Rubin configurations – multiplies MLCC content by orders of magnitude per rack. At the same time, MLCCs are increasingly replacing aluminum polymer capacitors in constrained server footprints, further lifting volumetric demand in exactly those high‑CV, fine‑pitch, high‑reliability grades that are hardest to expand in capacity.

What this means for MLCC users in AI and beyond

For OEMs, Tier‑1s and EMS providers, the combination of doubled inquiries, high utilization and rising spot prices suggests that contractual MLCC pricing for high‑end AI‑server parts is likely to come under upward pressure over the next few quarters. Designs that depend on advanced high‑CV MLCCs for GPU/accelerator power rails, VRMs and board‑level decoupling will be particularly exposed.

From a design‑in and supply‑chain perspective, several measures become advisable:

  • Review second‑source options and footprint flexibility for critical MLCC positions in AI and server platforms.
  • Engage early with distributors and manufacturers to secure allocations and forecast commitments for data‑center‑grade MLCCs.
  • Consider the total cost of ownership of power‑delivery architectures, as incremental improvements in layout or derating can sometimes reduce the absolute MLCC count in hot spots.

For other sectors—automotive, industrial, and consumer—the immediate impact will depend on product mix. Commodity, low‑capacitance MLCCs may remain relatively stable, while high‑CV and special‑construction parts (high temperature, high voltage, high reliability) can see knock‑on effects as capacity is prioritized toward AI‑server demand. The MLCC market is effectively splitting between high‑end segments with structural tightness and more commoditized ranges where pricing remains more competitive.

For the passive components community, AI servers are becoming a key structural driver that interacts with existing trends in automotive electrification and industrial digitalization. Even if Murata ultimately adopts a gradual approach to list‑price adjustments, the signal to the market is clear: high‑end MLCCs for AI infrastructure should be treated as strategic components, with corresponding attention to design, qualification and supply‑chain planning.

From an engineering perspective, the current AI‑driven “MLCC super‑cycle” translates into a higher probability of allocation pressure and selective price moves on advanced MLCC types rather than a uniform, across‑the‑board price hike. Hardware teams working on AI accelerators, high‑density power modules and server motherboards should:

  • Plan AVL diversification early across at least two or three tier‑1 MLCC suppliers plus regional alternatives where qualification and application allow, to reduce single‑source exposure on critical case sizes and voltage ratings.
  • Design PDNs with realistic second‑source options (slight differences in case size, voltage derating, dielectric or ripple rating) so that last‑minute substitutions remain technically acceptable if the preferred part is constrained.
  • Where AI‑rack volume is expected, coordinate long‑term forecasts and, where possible, framework agreements with distributors or OEM procurement to shield key MLCC positions from short‑term spot‑market spikes.
  • passive-components

This shifts part of the MLCC risk management into the architecture phase rather than leaving it purely to purchasing after the design is frozen.

Mid‑2026 update – Lead times confirm the tightening cycle.

By mid‑year, additional signals from other MLCC manufacturers support the picture of a structural imbalance in high‑end MLCC supply for AI servers. Holy Stone has warned that demand from AI‑server power subsystems is tightening availability of advanced MLCCs, with lead times now exceeding around 20 weeks and constraints expected to extend into 2027. Taken together with Murata’s internal price discussions and early‑year spot price increases of up to roughly 20% for selected high‑grade MLCC ranges, this suggests that AI‑related MLCCs are entering a multi‑year period of elevated pricing and extended lead times rather than a short‑lived spike.

This strengthens the case for early design collaboration with MLCC suppliers, multi‑sourcing of key values and, where appropriate, evaluation of alternative technologies for non‑critical positions in AI server power trees to preserve flexibility.

References

  1. Digitimes – “AI server MLCC orders double capacity; Murata considers price increase,” February 18, 2026.
  2. Bloomberg – “Murata Explores Raising Prices of Key AI Server Component,” February 17, 2026.
  3. Meyka – “Murata Manufacturing Stock Today, February 18: MLCC Price Hike Talks on AI Boom,” February 17, 2026.
  4. Investing.com – “Murata raises MLCC growth forecast for AI servers to 30% CAGR,” December 2, 2025.
  5. Biz Chosun – “AI server boom drives MLCC prices higher as Murata, Samsung split …,” February 7, 2026.
  6. Market and distributor commentary on MLCC spot price increases and supply tightness, early 2026

Related

Recent Posts

Itelcond Introduces High‑Voltage Aluminium Capacitors for Modern IGBT DC‑links

17.7.2026
9

Murata Unveils Lead Disc Ceramic Capacitors for Automotive Safety and EMI Suppression

15.7.2026
36

Square-Wave Harmonics and RMS Currents in Power Converters

14.7.2026
39

LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

14.7.2026
49

In the Age of AI, Every Watt Counts: Implications for Components

13.7.2026
59

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

9.7.2026
54

From DCL to SSC: Bridging Electrical Symptoms and Structural Indicators in Tantalum Capacitors

7.7.2026
63

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

2.7.2026
102

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

2.7.2026
82

Upcoming Events

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

Jul 29
17:30 - 18:30 CEST

To Ferrite or to Nanocrystalline in Transformer Design

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version