Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    MLCCs in the Age of AI: Q2 2026 Market Tightness

    AI Hardware Demand for Passive Components Dossier

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    ECIA Industry Pulse June 2026 Reaches Five‑Year High

    YAGEO Announces July 2026 Capacitor Price Increase

    YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

    Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

    binder Prints Electronics on 3D Components Connector Surface

    Vishay Introduces SMD Polymer PTC Thermistors for Fast Resettable Overcurrent Protection

    MLCCs in the Age of AI: Q2 2026 Market Tightness

    AI Hardware Demand for Passive Components Dossier

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK Enhances Efficiency of Materials Development Using Advanced AI

23.5.2023
Reading Time: 2 mins read
A A

TDK Corporation has announced the development of “Aim,” an original AI data analysis platform, as well as its launch for internal use in April 2023, as part of an effort to progress materials informatics (MI).

By refining its unique materials technology, TDK has accumulated data analysis technologies for material development of various products, including passive components. However, these technologies have been concentrated in individual business divisions and departments, making it difficult to be deployed throughout the company.

RelatedPosts

TDK Releases DC-link Film Capacitors with Ultra-low Inductance for SiC Power Converters

TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

TDK Releases Ultra‑small EMI Noise Suppression Filters

In recent years, MI, which utilizes AI and big data to improve the efficiency of material development, has garnered attention worldwide. TDK also started MI initiatives in 2013 and applied them to the development of magnetic and dielectric materials; the development of Aim commenced in 2018.

Aim is an original AI data analysis platform that was developed to widely deploy data analysis technologies accrued in individual departments throughout the company so that anyone can use them as well as compile high-quality data necessary for AI and big data utilization.

Since 2019, Aim has been trialed in Japan and has been used for high-speed and high-precision image analysis of materials to measure factors such as the shape and size of grains or particles in magnetic materials or dielectric materials, for example. Additionally, it has been leveraged to reduce analysis time and inspection time internally, and has undergone an expansion of functions in preparation for full-scale introduction of MI throughout TDK.

With the expansion of functions such as improved data analysis and more robust databases, as well as the development of mechanisms for MI utilization, the operation of Aim in MI began in April 2023. Initially, it will be operated by research-specific divisions in Japan, but the plan is to widely deploy it at additional locations in Japan and overseas. As TDK verifies its effects through operation and testing, more efficient MI mechanisms will be developed.

TDK will promote In-house DX related to material development through the operation of Aim and other means, and by accelerating MI promotion at TDK, the company’s original materials technology will continue to evolve to provide new valuable technologies and products.

Features

  • A unique AI data analysis platform (aggregates data analysis technologies cultivated internally)
  • Main applications: data analysis, particle analysis, and image analysis
  • Capable of high-speed and high-precision analysis using AI
  • Internal operation of Aim is intended to boost the speed and efficiency of material development

Related

Source: TDK

Recent Posts

ECIA Industry Pulse June 2026 Reaches Five‑Year High

1.7.2026
2

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
7

YAGEO Presents Single-Phase Common Mode Chokes for Industrial EMI Suppression

1.7.2026
6

Enabling the 800 V AI Server Era: How C0G High-Voltage MLCC Supports Next-Generation Power Architectures

1.7.2026
27

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
121

AI Hardware Demand for Passive Components Dossier

30.6.2026
54

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

29.6.2026
52

Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

29.6.2026
17

Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

26.6.2026
55

Upcoming Events

Jul 2
17:30 - 18:30 CEST

Can Claude design a production-ready Custom Magnetic Component?

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version