The Applied Power Electronics Conference (APEC) 2026 confirmed how quickly power conversion is evolving across AI data centers, EVs, industrial...
Read moreDetailsHydra, the traditional film capacitor producer, has developed a new proprietary gel filler for its cylindrical protected film capacitors that...
Read moreDetailsWürth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
Read moreDetailsBinder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain...
Read moreDetailsPanasonic’s super high precision thick film chip resistors target designs that need thin‑film‑class accuracy but with higher power handling and...
Read moreDetailsThe global electronics industry has gained a significant update to one of its key assembly-process standards with the release of...
Read moreDetailsVishay’s new Sfernice 40 LHE is a compact linear position sensor based on non‑contact Hall Effect technology, designed for accurate...
Read moreDetailsExxelia, in collaboration with CEA‑Leti, has demonstrated a miniaturized inverted‑F antenna (IFA) operating around 400 MHz by loading it with...
Read moreDetailsWürth Elektronik has introduced the WE-MXGA, a new series of AEC-Q200-qualified SMT power inductors for automotive applications that combine very...
Read moreDetailsPassive Components Blog has released the 2026 Annual Inductor, Transformer & Magnetics Technology Dossier, a 28‑page comprehensive analysis of how inductors...
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© EPCI - Leading Passive Components Educational and Information Site