Littelfuse has introduced two new omnipolar TMR magnetic switches, LF21173TMR and LF21177TMR, targeting space‑constrained, battery‑powered electronics that need precise, low‑power...
Read moreDetailsRubycon’s HPB series based on PMLCAP technology is entering mass production in January 2026, bringing a compact, high‑power‑density alternative to...
Read moreDetailsBourns has extended its Riedon SSD-1000A Series digital current sensors with a new assembly option using AEC-Q compliant components, targeting...
Read moreDetailsYAGEO Group, including the former KEMET ceramic business, has expanded its automotive‑grade X7R multilayer ceramic capacitor (MLCC) portfolio with new...
Read moreDetailsJianghai Europe has outlined a set of design and mounting measures that significantly increase the vibration stability of radial aluminum...
Read moreDetailsPassive Components Blog at passive-components.eu is the world’s leading blog, offering a specialized knowledge hub dedicated to passive components like...
Read moreDetailsBourns has released the BTJ Series thermal jumper chips, a family of surface‑mount thermal links designed to move heat efficiently...
Read moreDetailsBourns® introduced PF-SRC50E fuse series offering a compact high-voltage protection solution that complies with UL 248-13 and IEC 60269-4 (aR...
Read moreDetailsAs AI servers and GPU accelerators push to higher performance and power density, their power delivery networks are undergoing a...
Read moreDetailsAccording to article by Wu et al. from YAGEO researcher team in the International Journal of Applied Ceramic Technology, alloying nickel...
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