Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control

    DigiKey Releases Season Two of Sustainable Futures Series

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control

    DigiKey Releases Season Two of Sustainable Futures Series

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Würth Elektronik eiSos Announces Active Support for IoT Startups

17.9.2018
Reading Time: 2 mins read
A A

Source: Würth Elektronik eiSos news

Waldenburg (Germany), 17 September 2018 – Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, together with Navispace AG, organizer of the Innovation World Cup® Series, has agreed to a partnership to promote startups through an international innovation platform. For the first time, the prominent supporter will be in the starting line-up at StartupCon on September 18, 2018 at the LANXESS Arena in Cologne – with other events across the world set to follow.

RelatedPosts

Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control

The Innovation World Cup®, the IoT/WT event series successful for the last 14 years, is the world’s leading competition for startups looking to advance innovations in the field of Internet of Things and Wearable Technologies to market maturity. Thanks to the Innovation World Cup®, these companies are brought together with leading industrial partners.

“In addition to our established start-up promotion initiatives, we are glad to have the opportunity to support the Innovation World Cup® Series. What we really like about the events is that they are geared to practical support and networking,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group.

The assistance from the electronics manufacturer to the Innovation World Cup® participants includes providing advice, components, design kits, and brokering interesting contacts to business partners.

First event of a series

Würth Elektronik eiSos is part of StartupCon on September 18, 2018 at the LANXESS Arena in Cologne. CTO Alexander Gerfer is part of the international ‘Tech Jury’, which narrowed down the best 20 finalists of the completion in the run-up to the event. On the big day, the potential young entrepreneurs receive information, advise and support from experienced experts from all product areas of Würth Elektronik eiSos.

Further appearances at events in the Innovation World Cup® Series are currently being planned.

„We are delighted to have Würth Elektronik eiSos as a partner on board,” says Dr. Sonja Sulzmaier, Managing Director of Navispace AG, initiator of the Innovation World Cup® Series. “Würth Elektronik eiSos is one of the leading companies driving the digital revolution in the industrial sector. For this reason, Würth Elektronik eiSos is a prime partner for our Innovation World Cup® Series and the innovative techpreneurs who join our competition and innovation platform.”

featured image: Alexander Gerfer, CTO Würth Elektronik eiSos Group image source: Würth Elektronik eiSos

 

Related

Recent Posts

KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

25.6.2026
14

Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

23.6.2026
16

Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

17.6.2026
48

Murata Expands Ansys Simulation Models for RF inductors, MLCCs, and Power Inductors

16.6.2026
47

Murata Introduces World First 2.2uF 100V Soft‑Term MLCC in 0805 Size for Automotive

4.6.2026
77

Würth Elektronik Presents New Bidirectional Digital Isolators

20.5.2026
65

Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive

5.5.2026
104

KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

5.5.2026
61

Murata Introduces Crystal and NTC Set for Automotive UWB Timing

30.4.2026
62

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version