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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    Würth Elektronik ABC of Thermal Management textbook

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
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Würth Elektronik eiSos Announces Active Support for IoT Startups

17.9.2018
Reading Time: 2 mins read
A A

Source: Würth Elektronik eiSos news

Waldenburg (Germany), 17 September 2018 – Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, together with Navispace AG, organizer of the Innovation World Cup® Series, has agreed to a partnership to promote startups through an international innovation platform. For the first time, the prominent supporter will be in the starting line-up at StartupCon on September 18, 2018 at the LANXESS Arena in Cologne – with other events across the world set to follow.

RelatedPosts

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

The Innovation World Cup®, the IoT/WT event series successful for the last 14 years, is the world’s leading competition for startups looking to advance innovations in the field of Internet of Things and Wearable Technologies to market maturity. Thanks to the Innovation World Cup®, these companies are brought together with leading industrial partners.

“In addition to our established start-up promotion initiatives, we are glad to have the opportunity to support the Innovation World Cup® Series. What we really like about the events is that they are geared to practical support and networking,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group.

The assistance from the electronics manufacturer to the Innovation World Cup® participants includes providing advice, components, design kits, and brokering interesting contacts to business partners.

First event of a series

Würth Elektronik eiSos is part of StartupCon on September 18, 2018 at the LANXESS Arena in Cologne. CTO Alexander Gerfer is part of the international ‘Tech Jury’, which narrowed down the best 20 finalists of the completion in the run-up to the event. On the big day, the potential young entrepreneurs receive information, advise and support from experienced experts from all product areas of Würth Elektronik eiSos.

Further appearances at events in the Innovation World Cup® Series are currently being planned.

„We are delighted to have Würth Elektronik eiSos as a partner on board,” says Dr. Sonja Sulzmaier, Managing Director of Navispace AG, initiator of the Innovation World Cup® Series. “Würth Elektronik eiSos is one of the leading companies driving the digital revolution in the industrial sector. For this reason, Würth Elektronik eiSos is a prime partner for our Innovation World Cup® Series and the innovative techpreneurs who join our competition and innovation platform.”

featured image: Alexander Gerfer, CTO Würth Elektronik eiSos Group image source: Würth Elektronik eiSos

 

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