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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

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Bourns Expands Line of 1210-Size Automotive Grade Common Mode Chip Inductors

4.8.2021
Reading Time: 2 mins read
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Bourns introduces new compact and rugged inductors feature low radiation and high impedance over a broad frequency range delivering excellent EMI suppression.

Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the expansion of its line of 1210-size automotive grade common mode chip inductors. The new Model SRF3225TABM and SRF3225TAFD common mode chip inductor series offer low radiation and high impedance over a broad frequency range to suppress Electromagnetic Interference (EMI) coming into or leaving the system. The new series filters complement Bourns’ existing common mode chip inductor portfolio, and support higher data rate two wire bus systems in automotive, industrial and other electronic applications. The two new compact-sized series of Bourns® common mode inductors are designed with a ferrite core and are bifilar-wound to deliver a shielded construction with superior common mode noise suppression.

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The inductor core features a 0.3 mm minimum height sidewall terminal at each end designed to help enhance the component’s mechanical strength after it is assembled on the board. Both model series are AEC-Q200 compliant providing high reliability and durability. The Model SRF3225TABM-201Y is specifically designed to meet Open Alliance IEEE 100Base-T1 requirements, and Model SRF3225TAFD-101Y is well-suited for common mode noise suppression in typical CAN and higher data rate IEC 62228-3 CAN-FD Class II transmission systems. This model also supports differential to common mode rejection (DCMR) for CAN FD Class III.

The Bourns® Model SRF3225TABM and SRF3225TAFD series are available now and are RoHS compliant and halogen free.

Related

Source: Bourns

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