Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Image credit: Samtec

    How to Match the Right Connector with Protocol Requirements

    Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Bourns Expands Line of 1210-Size Automotive Grade Common Mode Chip Inductors

4.8.2021
Reading Time: 2 mins read
A A

Bourns introduces new compact and rugged inductors feature low radiation and high impedance over a broad frequency range delivering excellent EMI suppression.

Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the expansion of its line of 1210-size automotive grade common mode chip inductors. The new Model SRF3225TABM and SRF3225TAFD common mode chip inductor series offer low radiation and high impedance over a broad frequency range to suppress Electromagnetic Interference (EMI) coming into or leaving the system. The new series filters complement Bourns’ existing common mode chip inductor portfolio, and support higher data rate two wire bus systems in automotive, industrial and other electronic applications. The two new compact-sized series of Bourns® common mode inductors are designed with a ferrite core and are bifilar-wound to deliver a shielded construction with superior common mode noise suppression.

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

The inductor core features a 0.3 mm minimum height sidewall terminal at each end designed to help enhance the component’s mechanical strength after it is assembled on the board. Both model series are AEC-Q200 compliant providing high reliability and durability. The Model SRF3225TABM-201Y is specifically designed to meet Open Alliance IEEE 100Base-T1 requirements, and Model SRF3225TAFD-101Y is well-suited for common mode noise suppression in typical CAN and higher data rate IEC 62228-3 CAN-FD Class II transmission systems. This model also supports differential to common mode rejection (DCMR) for CAN FD Class III.

The Bourns® Model SRF3225TABM and SRF3225TAFD series are available now and are RoHS compliant and halogen free.

Related

Source: Bourns

Recent Posts

Transformer Safety IEC 61558 Standard

7.11.2025
1

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
23

Capacitor Lead Times: October 2025

6.11.2025
50

Coilcraft Introduces Ultra-Low Loss Shielded Power Inductors

6.11.2025
13

Exxelia Presents Smart Integrated Magnetics Solution at Space Tech Expo 2025 

5.11.2025
15

Murata Expands High Cutoff Frequency Chip Common Mode Chokes

5.11.2025
9

Transformer Design Optimization for Power Electronics Applications

4.11.2025
21

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
31

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

30.10.2025
16

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
42

Upcoming Events

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version