Source: Kemet news
Extended life, single digit ESR, CV and volumetric efficiency performance enable T598 devices to provide component solutions for ADAS, autonomous driving and digitalization. (more…)
Source: EPCI
Leading passive components manufacturers will discuss their hot products, application notes and latest technology during the Advanced Passive Components Workshop as part of the upcoming 2nd PCNS Passive Components Networking Symposium on 11th September 2019 in Bucharest, Romania. (more…)
Source: Kemet Engineering Center article
by: Cristina MotaCaetano, Techinal PM Director at KEMET Electronics Corporation
New materials and manufacturing processes enable polymer tantalum capacitors to pass automotive AEC-Q200 stress test requirements, as well specific electrical transient tests. Although the market supply chain challenges with high CV MLCC‘s availability and new automotive requirements with electrification, digitalization and autonomous driving are bringing new opportunities. (more…)
Source: AVX news
Representing the highest possible recognition of suppliers’ efforts to build stronger partnerships, improve quality performance, & provide excellent customer service, the 2018 TTI Supplier Excellence Award marks AVX’s fifth consecutive win in the Americas (more…)
Source: AVX news
AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, is showcasing its extensive portfolio of high-frequency, high-performance passive components optimized for microwave and RF applications extending across the automotive, consumer, telecommunications, military, and aerospace market segments at this year’s International Microwave Symposium (IMS 2019), which is taking place next week in Boston, Massachusetts. The conference begins on Sunday, June 2, and concludes on Friday, June 7, and the exhibition runs from Tuesday through Thursday, June 4–6. (more…)
Source: Kemet Engineering Center article
KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind. (more…)
Source: Würth Elektronik eiSos news
Waldenburg (Germany), 28 May 2019 – On 25 May the Formula E circus returned to the closed-down airfield at Berlin Tempelhof, transforming it into a suspense-packed venue for motor sport. And once again, Würth Elektronik was there as a technology partner: 70 customers and employees lined the race circuit, cheering on the Audi Sport ABT Schaeffler team with its pilots, Daniel Abt and Lucas di Grassi – with success. (more…)
source: Würth Elektronik news
Watertown (USA), 23 May 2019 – Würth Elektronik is pleased to present the first ever ExCEllence in Senior Design Showcase at the University of Texas at Dallas on May 24th and 25th. (more…)
Source: Kemet article
by Jonathan Ngo.
If you keep up with electronic components, the you’ll know solid electrolytic capacitors are all the rage. In this post, we’ll look at these relatively new V-chip style aluminum polymers and compare them to their predecessor – the traditional wet aluminum electrolytic. The advantages include, but are not limited to, lower ESR, better frequency performance, higher ripple handling capability, and longer lifespan. (more…)
Source: EPCI
Registration Opened for the 2nd edition of the PCNS Passive Components Networking Days Symposium that will take place 10th-13th September 2019 in Bucharest, Romania, hosted by Electronics, Telecommunication and Information Technology Faculty of Politehnica University of Bucharest. (more…)
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