Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    In the Age of AI, Every Watt Counts: Implications for Components

    Stackpole Extends Resistance Range of 2512 High‑Power Current Sense Resistors

    Wk 27 Electronics Supply Chain Digest

    Littelfuse Announced TVS Diodes for 48 V Automotive Systems

    Spectrum Controls Joins Modelithics Program to Offer High‑Fidelity RF Models for Resistors, Attenuators and Terminations

    RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

    In the Age of AI, Every Watt Counts: Implications for Components

    Stackpole Extends Resistance Range of 2512 High‑Power Current Sense Resistors

    Wk 27 Electronics Supply Chain Digest

    Littelfuse Announced TVS Diodes for 48 V Automotive Systems

    Spectrum Controls Joins Modelithics Program to Offer High‑Fidelity RF Models for Resistors, Attenuators and Terminations

    RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Coilcraft Releases Ultra Low Loss Power Inductors in Compact Package

24.1.2025
Reading Time: 3 mins read
A A

The ultra-low profile, compact 3×3 mm Coilcraft XGL3020 power inductor series offers the lowest DC losses and extremely low AC losses, positioning them as ideal solutions for a broad spectrum of DC-DC converters.

These components are particularly beneficial for applications where space is at a premium and efficient power management is a high priority. Their versatile design supports various non-isolated converter topologies, point-of-load (POL) applications, IoT devices, and numerous other high-demand environments.

RelatedPosts

Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control

Coilcraft Introduces SMT Current Sense Transformers for High‑Performance Power Electronics

These inductors are engineered with an industry-leading 80 V voltage rating, which broadens their applicability to wide Vin DC-DC converters and other demanding applications. Their AEC-Q200 qualification further enhances their credibility, ensuring they are reliable and robust enough to perform in automotive and other challenging environments.

Among their standout features are the industry’s lowest direct current resistance (DCR) and exceptionally low alternating current (AC) losses. This results in superior efficiency and performance, making them a top choice for power-sensitive applications. The soft saturation characteristics ensure superior current handling capabilities, allowing for consistent performance across a wide range of currents.

The XGL3020 Series covers a substantial inductance range from 0.10 to 4.5 µH, offering flexibility to meet various design requirements. Constructed from composite materials, these inductors effectively minimize core and winding losses. Environmentally, these components are RoHS compliant and free of halogens, aligning with global environmental safety standards. They feature tin-silver (96.5/3.5) over copper terminations, with alternative terminations available upon request at additional cost.

The components are lightweight, weighing only 0.10 grams, and operate within a wide voltage range of 0 to 80 volts. They are capable of functioning in ambient temperatures ranging from -40°C to +125°C, with a permissible rise of up to 40°C with Irms current. The maximum part temperature can reach up to +165°C, including ambient temperature and temperature rise, with appropriate derating considerations. Storage temperatures can vary between -55°C to +165°C for the components themselves, and -55°C to +80°C for tape and reel packaging.

In terms of durability, the XGL3020 Series is designed to withstand high soldering heat, enduring up to three 40-second reflows at +260°C, with cooling to room temperature between cycles. This resilience ensures their continued performance and reliability, even under frequent high-temperature soldering conditions, making them an excellent choice for various industrial and commercial applications.

Features

  • Industry’s lowest DCR and ultra low AC losses 
  • AEC-Q200 qualified
  • Superior current handling with soft saturation characteristics
  • Wide inductance range from 0.10 to 4.5 µH

Core material Composite 
Core and winding loss See www.coilcraft.com/coreloss 
Environmental RoHS compliant, halogen free 
Terminations RoHS compliant tin-silver (96.5/3.5) over copper. Other terminations available at additional cost. 
Weight: 0.10 g 
Operating voltage: 0 – 80 V 
Ambient temperature –40°C to +125°C with (40°C rise) Irms current. 
Maximum part temperature +165°C (ambient + temp rise). Derating. Storage temperature Component: –55°C to +165°C.  Tape and reel packaging: –55°C to +80°C 
Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles 
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity)
Packaging 1000/7″ reel; 3500/13″ reel Plastic tape: 12 mm wide, 0.25 mm thick, 8 mm pocket spacing, 2.2 mm pocket depth 
PCB washing Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf.

Related

Source: Coilcraft

Recent Posts

In the Age of AI, Every Watt Counts: Implications for Components

13.7.2026
13

Stackpole Extends Resistance Range of 2512 High‑Power Current Sense Resistors

13.7.2026
8

Littelfuse Announced TVS Diodes for 48 V Automotive Systems

10.7.2026
17

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

9.7.2026
44

Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

9.7.2026
72

YAGEO Presents NANOMET Soft Magnetic Cores for High‑Density Power Conversion

8.7.2026
100

Coilcraft Releases High-Current Ferrite Beads for CISPR 25 EMC compliance

8.7.2026
42

Vishay Unveils Multi-Turn Position Sensor for Harsh Industrial Environments

7.7.2026
30

YAGEO Introduces Automotive MOV Surge Protection Varistor

7.7.2026
28

Upcoming Events

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

Jul 28
8:00 - 11:00 CEST

Post Procurement Testing of EEE Components for LEO Space Applications

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version