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    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

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    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

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    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

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    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

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Combining Capacitors and Inductors into Tiny 3D Rolled Membrane

14.8.2020
Reading Time: 2 mins read
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This electron microscope image shows an array of new chip components that combine the inductors (blue) and capacitors (yellow) needed to make electronic signal filters in phones and other wireless devices. Source: Xiuling Li

This electron microscope image shows an array of new chip components that combine the inductors (blue) and capacitors (yellow) needed to make electronic signal filters in phones and other wireless devices. Source: Xiuling Li

New hybrid components could shrink the size of electronic filters used in communication devices. Researchers at the University of Illinois, Urbana-Champaign have devised a method of combining capacitors and inductors in a tiny, 3D rolled membrane. This will save space in the electronic filters found in phones and other wireless devices. They eliminate or enhance specific input signals to get the best output signals. While essential, these filters take up space on the chips that researchers are constantly trying to make smaller.

In the lab, the team used a specialized etching and lithography process to pattern 2D circuits onto thin membranes. In the circuits, they join capacitors and inductors together with ground or signal lines, all in a single plane. The multilayer membrane was then rolled into a thin tube and placed on a chip. 

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Combining capacitors and inductors on a single cylindrical tubular component begins with depositing metals using electron-beam evaporation and lithography to define the metal pattern and etching process. The final etching step triggers the self-rolling process of the stacked membrane.

“The patterns, or masks, uses to form the circuitry on the 2D membrane layers can be tuned to deliver whatever kind of electrical interactions we need for a particular device,” says researcher and grad student Mark Kraman. “Experimenting with different filter designs is relatively simple using this technique because we only need to modify the mask structure to make changes.”

The team tested the rolled components performance and found that the filters were suitable for applications in the 1 to 10 GHz frequency range. Although the designs are for use in RF communication devices, the team is confident that other frequencies, including those in the megahertz range, will be possible based on their track record in developing high-power inductors in past projects.

The team is working with several simple filter designs but says filter network combination can theoretically be made using the same process. The researchers suggest their method of combining inductors and capacitors monolithically could bring passive electronic circuits to a whole new level.

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Source: University of Illinois

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