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    Samsung Electro-Mechanics Releases High-Capacitance MLCCs for AI Server Applications

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TDK Announces MLCCs with World-Class Capacitance for Automotive Applications

29.9.2020
Reading Time: 2 mins read
A A

TDK Corporation has developed new products in its CGA series of multilayer ceramic capacitors (MLCC) for automotive applications, achieving world-class capacitance* of 22μF in 2012 size (2.0 x 1.25 x 1.25 mm) and 47μF in 3216 size (3.2 x 1.6 x 1.6 mm). Volume production began in September 2020.

Advanced driver-assistance systems (ADAS) are becoming increasingly important for improving safety. At the same time, a growing number of features supporting autonomous driving have been established. The ICs used to control these features are therefore continuously providing more functionality, and a growing number of smoothing and decoupling MLCCs are used for noise suppression. From the viewpoint of space-saving substrate designs, the demand for downsized, high capacitance MLCCs continues to increase.

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The new CGA series achieves smaller sizes and higher capacitance than our conventional products, allowing a reduction in the number of MLCC components, and enabling space-saving designs. TDK will continue to extend the product range and serve the growing range of automotive applications.

* As of September 2020, according to TDK research

Glossary

  • AEC-Q200: Automotive Electronics Council standard for passive automotive components.
  • Smoothing: Suppressing and smoothing voltage fluctuations of pulsating voltage in rectified current by charging and discharging high capacitance capacitors.
  • Decoupling: Suppressing voltage fluctuations of IC power lines by inserting capacitors between the power line and the ground and by temporarily supplying current when the electrical load abruptly changes.
  • ADAS: Advanced Driver-Assistance Systems.

Main applications

  • Smoothing and decoupling of power lines for electronic control units (ECU) in automotive applications.

Main features and benefits

  • World’s highest-class capacitance (22μF in 2012 size, 47μF in 3216 size).
  • Downsizing with high capacitance to enable the reduction of the number of components and space-saving designs.
  • High reliability due to AEC-Q200 compliance.

Key data

TypeDimensions
[mm]
Temperature characteristicsRated voltage
[V]
Capacitance
[μ F]
CGA4J1X7T0J226M2.0 x 1.25 x 1.25X7T6.322
CGA5L1X7T0G476M3.2 x 1.6 x 1.6X7T447

Related

Source: TDK

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