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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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Modelithics Launches NEW 3D Library for Cadence Clarity 3D Solver

7.12.2023
Reading Time: 3 mins read
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Modelithics®, the leading independent provider of accurate RF/microwave models for multiple EDA simulation software tools, is pleased to launch the NEW Modelithics 3D Library for Cadence® Clarity™ 3D Solver!

The release of the new Modelithics 3D Library for the Cadence Clarity 3D Solver includes nearly 400 3D geometry models. Modelithics highly accurate encrypted full-wave EM analysis models are included for components such as inductors, resistors, filters, connectors, and packages from many of today’s leading suppliers, including Coilcraft, Gigalane, Johanson Technology, Mini-Circuits, Passive Plus, Vishay-Barry, SV Microwave, TDK and more! All Modelithics 3D EM models are based on physical dimensions and material properties with each including their own dedicated, fully documented model datasheet. 

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Modelithics CapV MVP Library: Measurement-Based Models for Varactor Chip Simulation

Modelithics is the industry leader in providing highly accurate, premium passive and active RF and microwave circuit simulation models, including measurement-based highly scalable equivalent circuit models and measurement-validated 3D EM models. The Modelithics 3D EM models are based on physical dimensions and material properties, typically shared under NDA with Modelithics, from partnering supplier companies and then later encrypted to protect manufacturers’ IP. Modelithics 3D EM models are readily combined with other circuit or module geometry/material definitions, to provide accurate simulations that take electromagnetic interaction effects into account, using the Cadence Clarity 3D Solver’s full-wave solution to Maxwell’s equations. 

The Cadence Clarity 3D Solver is the third Cadence simulator to be added to Modelithics’ portfolio of compatible EDA software simulation tools. Also, available is the Modelithics COMPLETE Library or measurement-based equivalent circuit models for the Cadence AWR Design Environment and the Cadence Spectre RF Option, which represents more than 27,000 passive and active components from 70+ vendors. Modelithics President & CEO, Larry Dunleavy stated: “I’m very pleased to see Cadence continue to recognize that the increased availability of accurate measurement-validated simulation models for a wide range of devices and components are essential for customer design success with Cadence tools. In this case, we are together addressing the growing need for customers to be able to assess the effects of complex electromagnetic interactions between components using full-wave analysis with the Cadence Clarity 3D Solver.” 

The Cadence Clarity 3D Solver is a 3D electromagnetic (EM) field solver for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. It enables designers to tackle the most complex EM challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning (ML) applications with gold-standard accuracy. “Leveraging Clarity 3D encrypted models in the Cadence ecosystem is a natural unification between our design platforms and simulation capabilities,” said Gary Lytle, Product Management Director in the Multiphysics System Analysis Business Unit at Cadence. “Using our proprietary techniques to protect the model creator’s IP while enabling users to simulate complete systems is critical to our joint customers’ ongoing design success. Modelithics is the right organization to create, curate and deliver validated models to this ecosystem, providing accurate results and accelerating time to market.” 

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Source: Modelithics

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