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    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

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    source: Samtec

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    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

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    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

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Smiths Inteconnect Releases New Planar RF Filter for Configurations up to 18 GHz

22.4.2020
Reading Time: 2 mins read
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Smiths Inteconnect announced today the introduction of its new Planar X Series of RF filter solutions with bandpass, bandstop, lowpass and highpass configurations up to 18 GHz (Ku Band). Leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution.

The new Planar X Series is part of an overarching initiative that entails the creation of first-class board level ceramic based thick film RF filters, designed and tested to support various applications markets.

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The small footprint, light weight and surface mountable configuration allow for high volume pick and place applications and make Planar X Series ideal for SATCOM, Radar and Broadcasting industries.

“Planar X Series compliments our broad portfolio of RF and Microwave components with the latest technology in RF filters, offering premium performance in a small package,” says Paul Harris, Sales and Marketing VP at Smiths Interconnect.

“The technology has proven reliable in the most demanding environments building upon years of high reliability as a supplier of quality board level components. The addition of the planar filter technology is a natural progression to our existing RF filter product portfolio and Smiths Interconnect is excited to offer this capability in combination with value added testing services”.

With the Planar X Series Smiths Interconnect leverages existing thick film process technology on various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:

  • Compact size and light weight, resulting in reduced overall system mass in critical space applications
  • Excellent rejection characteristics, providing best in class RF performance
  • Robust materials, suitable for harsh environment
  • Integration capabilities

Related

Source: Smith Interconnect

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