The paper “AI Hardware Development and Its Consequences for Passive Electronic Components” was presented by Tomas Zednicek, EPCI European Passive Components ...

The paper “Passive Components in AI Systems” was presented by Slavomir Pala, KYOCERA AVX Lanskroun, Czech Republic at the 5th PCNS Passive ...

The paper “Computer Vision‑Driven Verification of Passive Component Assembly on Space‑Grade PCBs” was presented by Carmen Galán,  and Manuel Domínguez, ALTER Technology, Seville, Spain ...

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, added a new common mode chip ...

The paper "High-Frequency Capacitor Performance of Novel Embedded Electrode Design" was presented by Mark Simpson, Quantic Eulex, Monterey Park, CA, USA, at the 5th PCNS Passive Components Networking ...

The paper "Capacitor Degradation and Failure Mechanisms: Exploring Different Causes Across Technologies" was presented by Frank Puhane, Würth Elektronik eiSos GmbH ...

The paper "New Construction And Packaging Process For Highest Voltage Aluminium Polymer Electrolytic Capacitor" was presented by Tim Kruse, Department of ...

Bourns releases automotive grade, AEC-Q200 compliant SDE0403AT SMD power inductor series with higher current density, high saturation current and low-profile ...

This article based on Modelithics blog article "taking advantage of discrete optimization" explains hot to optimize discrete components in RF ...

Modelithics®, a leading independent provider of precise RF/microwave models for various electronic design automation (EDA) simulation software tools, is excited ...