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Passive Components News
SCHURTER Introduces PPTC Resettable Overcurrent Protection for Compact Electronics
SCHURTER has introduced a new family of polymer PTC (PPTC) resettable fuses in both radial...
TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand
TrendForce’s latest MLCC industry research reveals that the AI arms race among global cloud service...
Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution
Würth Elektronik’s new WE‑FNCS flexible nanocrystalline sheets target exactly this need by providing a thin,...
Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs
Samsung Electro-Mechanics has introduced an automotive-grade multilayer ceramic capacitor (MLCC) that combines 100 µF capacitance...
YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails
YMIN presents hybrid aluminum electrolytic capacitors from its VHT series as bulk and output filtering...
Samsung Presents Ultra‑Thin Silicon Capacitors for AI and Server PDN
Samsung Electro‑Mechanics has introduced a dedicated silicon capacitor lineup targeting high‑performance semiconductor packages, AI servers,...
YAGEO Introduces 310VAC SMD Y2 Safety MP Capacitors for Compact EMI Filtering
YAGEO Group’s SMP253 series is a surface‑mount Y2 safety metallized paper capacitor family rated 310...
DMASS: European Components Distribution Returns To Growth In Q1 2026
The European electronic components distribution market delivered a robust return to growth in the first...
Wk 24 Electronics Supply Chain Digest
Electronics Supply Chain Weekly Digest 6-12-26. DATAPOINT OF THE WEEK: Passenger car retail sales in China...
Bourns Completes Rakon Acquisition, Enters Timing Market
Bourns has completed its acquisition of Rakon and is formally entering the high-performance frequency control...
Knowles Releases 3825 X1/Y2 Safety MLCCs for High‑Voltage Applications
Knowles Precision Devices has expanded its X1/Y2 safety‑certified multilayer ceramic capacitor (MLCC) portfolio with a...
Knowles Expands High Q Ceramic Core Inductors
Knowles Precision Devices has expanded its ceramic core inductor portfolio to address a broader range...
TAIYO YUDEN Releases 220uF 1210 Automotive MLCC
TAIYO YUDEN has released a new automotive‑grade multilayer ceramic capacitor (MLCC), type MAASA32MAD7227MP1D71, offering 220...
HEICO’s Exxelia Expands High-Voltage Ceramic Capacitor Portfolio with CalRamic Acquisition
HEICO Corporation has announced that its Exxelia subsidiary has acquired a 90% stake in CalRamic...
Vishay Extends Automotive Ferrite Beads for High‑Current EMC Noise Filtering
Vishay has expanded its ILHB series of Automotive Grade multilayer chip ferrite beads, adding higher...
CapXon Earns EcoVadis Bronze Medal for Sustainability Performance
CapXon has been awarded the EcoVadis Bronze Medal, recognizing the company’s sustainability performance and placing...
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Inter-connect, Electro-mechanical and Sensors
SCHURTER Releases SMT Micro Switch for Compact HMIs
The SCHURTER TCS43 is a microminiature surface mount tactile (micro) switch aimed at space‑constrained human–machine interfaces that still require clear,...
binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
M12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
Amphenol Industrial Operations has expanded its Liquid Cooling Systems portfolio with new MQD, UQD/UQDB Rev 2.0 and SHQD connector families...
Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
Hirose Electric has introduced the IT18 series, a COM‑HPC compliant BGA mezzanine connector designed for high‑speed, high‑density embedded computing modules...
Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
Littelfuse introduces TDB series ultra‑miniature, half‑pitch surface‑mount DIP switches that are designed for high‑density PCB layouts where space, reliability, and...
SCHURTER Releases Compact SMT DIP Switches
SCHURTER introduces DTCD and DTCJ series ultra‑miniature 1.27 mm pitch SMT DIP switches designed for high‑density electronic assemblies where classic...
Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based...
Würth Elektronik Releases Heat Sinks for TO and IC packages
Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages...
e-Symposium: ESA SPCD, PCNS, WE Digital Days
Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast
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